Currently under 6 GHZ crowded and the available frequency band is broken, in return for greater bandwidth, making 5 g start moving in the millimeter wave (mmWave).However, millimeter wave signal attenuation fast, vulnerable to block and cover the features such as short distance, make 5 g base stations and terminals development technology challenges, also will affect the design of the antenna and the radio frequency (RF) front-end.

ADI communications infrastructure business in China market strategy by understanding yong pointed out that large-scale antenna array technology, 5 g of rf components for integration degree, bandwidth and cost higher requirements.5 g spectrum contains low frequency band and high frequency under 6 GHZ millimeter-wave frequencies, even low frequency band 4 g band is much higher than now, so, if you want to achieve 5 g RF performance requirements, will provide related RF components process and circuit design has brought a bigger challenge.

More than ever RF front end using Discrete component (Discrete 'Components), go through the RF on the printed circuit board (PCB) line (Trace) connect the transceiver (TRx), power amplifier (PA), low noise amplifier (LNA) and the main passive Components such as Filter (Filter).Up the dosage of RF components, however, Qorvo product marketing manager ching-hung Chen pointed out that the higher order 4 g mobile phone RF component modularization is the inevitable trend, and 5 g will further accelerate device integration trend.Among them, the module type including encapsulation, low loss board SMT SMT, soft board, etc., but no matter how must solve the problem of heat concentration, high power consumption

Anokiwave asia-pacific sales director Zhang Zhaojiang further illustrate, 5 g millimeter wave signal is easy to wear, interference, in order to reduce signal loss in the process of PCB delivery, should be the RF components integrated together with the antenna, to shorten the RF line.Moreover, with high frequency, the antenna size and the distance between each antenna will be significantly narrowed, it is difficult to pick up will be discrete device integration between antenna, so must the RF components and integrated antenna.In response to this trend, the company using silicon processing technology to the RF device integration into four channels of millimeter wave IC, again with antenna integrated ChengMo group, in order to solve the problem of signal transmission loss.

In addition, Zhang Zhaojiang also said, base stations heat dissipation problem for RF components with the antenna design is a big challenge, track radar and RF technology is mainly used in military defense, the size and cost are not in the design of the main considerations, so if you want to use the relevant technology to realize commercial base stations, in addition to overcome the problem size, base stations heat brought about by the huge cost is also a big problem.And Anokiwave also try to improve the heat dissipation problem from the packaging, the first generation of IC USES QFN packaging technology, but given that plastic encapsulated the cooling effect is poor, so the second generation product substitution of wafer level grain size package (WLCSP), as well as improve heat dissipation problems can further reduce the size of our packaging.